CoWos 結果共85筆

受惠AI晶片需求持續攀升，台積電6月營收年增67.9%，上半年累計營收年增35.6%。為因應先進封裝需求，公司也將於嘉義科學園區新增兩座先進封裝廠，進一步擴大產能並強化台灣AI晶片供應鏈布局。

人工智慧（AI）晶片帶動先進封裝需求，台積電持續擴充CoWoS產能仍供不應求。外媒報導英特爾（Intel）在美國政府積極支持下搶攻先進封裝，封測台廠包括日月光、矽品、力成、京元電等也順勢搭上訂單外溢效應。

台積電上月在日本宣布與Ibiden及群創合作，開發玻璃核心載板（glass core substrate，GCS）新技術，更引來輝達等美系巨頭有意合作的興趣。不過，外資高盛卻對台積電的GCS發展進度持保守看法，因此也將日本玻纖布大廠 Nittobo（日東紡）評等調升至買進，知名分析師郭明錤表示，仍樂觀看待GCS發展，認為該技術極具潛力。

媒體報導美國總統川普指台積電將倍增在亞利桑那州興建中的晶圓廠規模，美晶片市占率將達50%。經濟部長龔明鑫下午表示，台積電目前已公布在台灣興建及規劃中的晶圓廠，加上CoWoS先進封裝產能共有16座，「美國未來再怎麼蓋，也不可能是這個數量」。

台積電持續擴產CoWoS並革新技術，欲鞏固先進封裝領先，與艾克爾簽訂長約盼緩解產能吃緊，也讓英特爾EMIB技術有可趁之機。專家分析，已有科技巨擘轉向英特爾EMIB封裝，使英特爾封裝業務獲得突破，對台積電形成實質市占分流壓力。

特廢處理廠商台鎔科技（6947）今（16）日公布最新業績，今年前5個月累計營收寫下年增70.59%的成績。法人看好，隨著高階科技廢棄物處理需求迎來爆發期，台鎔今年獲利有望創下歷史新高，更因受惠高斜率成長的科技股特質，滾動本益比衝上70倍，遠超傳統環保同業，成為綠能環保市場新星。

台積電（2330）2奈米先進製程預計於今年下半年迎來強勁放量，隨著先進封裝CoWoS產能供不應求，後段封測廠將迎來爆發性成長。法人最新報告強力點名看好「封測三雄」日月光投控（3711）、京元電子（2449）及力成（6239），其中龍頭產業日月光，更將目標價大幅調升至600元。

AI與資料中心需求急速擴張，全球晶片產業面臨新一波產能瓶頸！閎康科技董事長謝詠芬指出，來自美國客戶的測試與封裝需求大幅增加，CoWoS檢測更是供不應求，PCB板原材料供應變得相當搶手，這波晶片荒2.0主要集中在AI高階算力、高頻寬記憶體及先進封裝領域。

The restaurant was the Brick Kiln, a good but unflashy Taipei spot far from any conference hall. The host stood on a stool to be seen. The guest list ran to more than thirty CEOs, between them representing close to a trillion US dollars in market capitalization and almost every link in the global AI hardware supply chain. Jensen Huang toasted, thanked, moved from table to table, told an affectionate joke about a portrait he said looked more like TSMC’s C.C. Wei than himself, and at the end of the evening walked out into the street to hand sweets to the families and children who had gathered hoping for a glimpse. ＂Chemistry＂ was the word the Nvidia blog post used to describe the event. The casualness was the point.

Nvidia CEO and founder Jensen Huang was not exaggerating when he described Taiwan as the epicenter of the AI revolution. Without the island’s top electronics contract manufacturers and its uniquely dense ecosystem of suppliers, Nvidia could not have built AI infrastructure at the speed or scale the world is now witnessing.

Nvidia CEO and Founder Jensen Huang has laid the table for Computex 2026 next week with all the main courses already plated, following Nvidia’s blockbuster quarterly numbers and his definition of the next wave of growth, ACIE.

隨著人工智慧（AI）與高效能運算（HPC）晶片需求持續高漲，台積電（TSMC）的技術領先優勢依然難以動搖。花旗銀行（Citi）在最新發布的研究報告中指出，台積電的先進封裝和晶片製造技術在短期內「不太可能面臨顯著的競爭壓力」。分析師預期，受惠於2026年與2027年強勁的AI利多因素推動，台積電經典的CoWoS先進封裝產能有望大幅成長，同時系統級整合晶片（SoIC）等次世代技術也將在未來幾年爆發，持續帶動市場需求。

Taiwan’s chip packagers and testers, the companies that take a freshly made semiconductor and turn it into a usable, qualified module, are in the middle of the biggest expansion their industry has ever seen.

TSMC used its 2026 Technology Symposium in Hsinchu on May 14 to tell two stories. The first was about steel and concrete. The second was about light.

TSMC’s April revenue of NT$410.7 billion (US$12.6 billion) was up 17.5 percent year on year and down 1.1 percent from March, the company’s highest April on record and second-highest monthly result ever. Cumulative revenue for the first four months reached NT$1.545 trillion (US$47.4 billion), up 29.9 percent from the same period in 2025.

The April 2026 monthly revenue reports filed on the Taiwan Stock Exchange confirmed what the first quarter had already strongly implied: the AI infrastructure cycle is no longer a story about TSMC and a handful of server assemblers. It is now spread across the full hardware stack, from copper-clad laminates and ABF substrates to liquid-cooling modules, server rails and memory.

台股今（7）日晶圓代工廠力積電（6770）開盤直衝高點，股價停在63.9元一直到收盤，成交張數305,575張，股價連三天上漲11.95%, 是記憶體四雄裡唯一紅燈股。而在營運方面也傳捷報，繼先前成為台積電CoWoS先進封裝夥伴後，再度打入英特爾EMIB先進封裝供應鏈，成為「聯電第二」。

For most of the last twenty years, the MediaTek story has been about smartphones. The company built itself into the world’s largest mobile chip designer by volume on the back of mid-tier Android handsets sold across Asia, Latin America, and Europe. At Computex 2026, the next chapter of the company’s history will begin to unfold.

Computex 2026 opens on June 2 in Taipei under the banner “AI Together,” and for Taiwan’s server makers the timing is close to perfect. The first quarter delivered record results across the entire group. Hyperscaler orders for Nvidia’s next-generation GB300 rack systems are accelerating into the second half of the year. And a new category of compute that the industry has started calling Physical AI, is opening a fresh growth lane alongside the familiar workloads of training and inference.

IC設計龍頭聯發科（2454）在AI與ASIC領域再出招！曾任職於台積電（2330）、深耕先進封裝技術多年的重量級人物余振華，在自台積電退休後，已正式加入聯發科擔任「非全職顧問」。聯發科隨後證實此消息，表示將借重其深厚實戰經驗，深化與台積電在先進封裝上的合作，此舉引發半導體業界高度關注。

在2026年北美技術論壇上，台積電公布了一份最新技術藍圖，揭示這家全球最大的晶圓代工廠在哪些領域下重注、又在哪些方面選擇保守。

摩爾定律逼近盡頭，封裝接管霸權。當英特爾、三星以傾國之力抄近路突圍，台積電回防祭出次世代面板級封裝CoPoS：「以方代圓、產能翻倍」。

At its 2026 North America Technology Symposium, TSMC unveiled a roadmap that highlights where the world’s largest contract chipmaker is placing its boldest bets and where it is choosing restraint.

台積電全球業務資深副總經理暨副共同營運長張曉強告訴路透社，台積電計畫在2029年前於亞利桑那州啟用一座晶片封裝廠。

全球晶片產業競爭，龍頭台積電將在美國擴建兩座封裝廠，分擔「美國製造」產能。至於美國代表「英特爾」，則挾著美國政府入股和資金補貼，買進價值百億台幣的「新武器」，希望發展18A先進製程。英特爾想重返巔峰，勢必需要跨過台積電這座大山，不過因為晶片良率低，加上要重建客戶信任感，現在英特爾晶片生產的主要客戶，可能只有英特爾自己。