productivity 結果共5筆

Discover how MediaTek is pioneering the future of generative AI with its new traditional Chinese large language model, MediaTek Research BreeXe, tailored for Taiwanese users seeking culturally relevant solutions.

Discover how MediaTek is leading the AI revolution with its latest generative AI tools, DaVinci and BreeXe, designed to enhance productivity and reshape industries.

Discover how a Taiwanese cybersecurity firm’s adoption of a four-day workweek has led to increased efficiency and improved work-life balance, setting a trend amidst global shifts towards reduced work hours.

The Ministry of Labor reported a significant increase in the number of furloughed workers, with the manufacturing industry being the most affected. The labor ministry also predicted a high demand for labor in the accommodation and food services industry and the wholesale and retail trade sector. The global labor shortage crisis has led to businesses implementing solutions such as cross-training to boost productivity. The Regent Taipei successfully reduced its labor shortage rate through cross-training and creating a positive work environment. Fair wages and a positive work environment are believed to be key factors in employee retention.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.