chip 結果共76筆

Discover how Kumamoto Prefecture in Japan plans to become a semiconductor hub by courting TSMC for a new chip factory, aiming to replicate Taiwan’s Hsinchu Science Park success.

Apple Inc. collaborates with TSMC on AI chips for data centers, as reported by The Wall Street Journal. The project, years in development, aims to enhance server capabilities for AI model execution. With speculation around the iPad Pro featuring the M4 chip for AI tasks, Apple’s AI advancements are anticipated to be highlighted at the upcoming iPhone launch and possibly at the Worldwide Developers Conference.

The U.S. CHIPS and Science Act seeks to boost domestic semiconductor manufacturing. John Neuffer, CEO of the Semiconductor Industry Association, is optimistic about the act, highlighting early private sector commitments and the critical need to rebalance global chip manufacturing.

Discover how Huawei’s new Pura 70 series, featuring the advanced Kirin 9010 processor, marks a significant technological leap and defies U.S. restrictions, selling out quickly after launch.

Taiwan’s Ministry of Foreign Affairs (MOFA) is nearing the completion of a five-year agreement with Czechia to establish an advanced chip design center, enhancing semiconductor capabilities. Amidst controversy over funding and accusations from the Taiwan People’s Party (TPP), MOFA clarifies the project’s goals and budgeting, emphasizing the initiative’s focus on leveraging Taiwanese technology to bolster Czechia’s semiconductor industry and expand European business opportunities for Taiwanese companies.

The U.S. National Science Foundation (NSF) has launched a groundbreaking program in Taiwan to support the country’s semiconductor and AI industries, marking the first time the NSF has sponsored seminars abroad to discover and fund deep tech companies. The initiative aims to strengthen Taiwan’s role in global technology supply chains and drive economic growth for both countries.

TSMC announces plans for a third chip fab in Arizona while maintaining Taiwan as its primary production hub, with 80-90% of capacity remaining in Taiwan. TSMC’s advanced semiconductor technology is distributed across Hsinchu, Taichung, and Tainan, with new 2nm factories in Baoshan and Kaohsiung. TSMC is also planning a 1nm site in Chiayi or Yunlin, pending government assistance.

Discover how TSMC’s groundbreaking $65 billion investment in Arizona, supported by the U.S. Department of Commerce with subsidies and loans, aims to revolutionize the semiconductor industry with the world’s most advanced 2-nanometer chips, creating thousands of jobs and bolstering AI technology.

Discover how Taiwan’s Semiconductor College in Hsinchu is attracting students from Vietnam to address the talent shortage in the semiconductor industry. Learn how Taiwan is leveraging Southeast Asian students to secure its position as a global leader in chip manufacturing.

Ferrari’s sales in Taiwan have surged in recent years, driven by the chip boom and global supply chain shifts. The luxury carmaker’s profits hit a record high, with Taiwan outpacing mainland China and Hong Kong in supercar sales growth. Despite Europe and the US being primary markets, Taiwan saw a significant rise in Ferrari sales, capturing 40% of the local two-door supercar market.

MediaTek is targeting the automotive market with the launch of the Dimensity Auto Cockpit SoC (system-on-chip) platform at Nvidia GTC.

Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.

《路透社》報導，兩名知情人士透露，晶片大廠台積電（TSMC）擬在日本建立先進封裝產能。其中一個選項是將獨家的CoWoS（Chip on Wafer on Substrate）封裝技術導入日本，目前台積電的CoWoS產能都在台灣。據報導，隨著AI晶片需求急遽增加，台積電先進封裝產能吃緊，因此將聚集製造裝備與材料製造商的日本列為候選地點。

Stay updated on the latest developments in Taiwan’s semiconductor industry with this story on the National Development Council Minister Kung Ming-hsin’s affirmation that Taiwan Semiconductor Manufacturing Company’s cutting-edge processing techniques will continue to be based in Taiwan. Learn about TSMC’s global expansion plans and Taiwan’s strategies to maintain its industrial competitiveness in the face of growing demand for advanced chipsets.

TSMC, the leading semiconductor manufacturer, has inaugurated its first fabrication plant in Kumamoto, Japan, marking a pivotal step in its global expansion. This strategic move aims to enhance Japan’s chip industry and TSMC’s manufacturing capabilities, with plans for a second fab and a commitment to sustainability.

U.S. Secretary of Commerce Gina Raimondo aims for the U.S. to produce 20% of the world’s cutting-edge semiconductors by 2030. Companies like Intel, TSMC, and Samsung are seeking over US＄70 billion in subsidies under the 2022 CHIPS and Science Act. Raimondo highlights TSMC’s Arizona project and expresses gratitude for their contributions. The government plans to fund more projects to achieve the 20% global semiconductor production target by 2030. The U.S. Department of Commerce is expected to announce new subsidies, with TSMC likely to receive funding.

Hon Hai Precision Industry Chairman Young Liu has stated that the AI server industry is facing a shortage of AI chips, which is expected to persist throughout 2024. Liu emphasized that the problem can only be resolved by increasing production capacity in new factories. He also highlighted that geopolitical and economic conditions may affect the demand for consumer electronic products this year. Despite holding a significant position in the global AI server industry, Hon Hai is facing a shortfall in the supply of AI chips from major manufacturers like NVIDIA. While some second and third-tier factories claim their AI server performance will be good in 2024, Liu expressed skepticism and confusion about this situation.

President Tsai Ing-wen visited a quantum computer project funded by the National Science and Technology Council (NSTC) and Academia Sinica, witnessing the creation of Taiwan’s first self-developed, five-qubit superconducting complete system quantum computer. The president praised Academia Sinica for developing the five-qubit quantum computer in just two years and expressed her hopes for the quantum team to maintain Taiwan’s important position in the field. Academia Sinica’s president, James C. Liao, announced that the institution will continue investing in the quantum base, transitioning from basic experimental development to practical application through vertical integration. Academia Sinica has accumulated significant research and development capabilities in quantum technology, including achievements in quantum computer chip design, production, and state control and reading techniques for quantum bits. In 2023, Academia Sinica successfully developed Taiwan’s first five-qubit quantum chip and made the quantum computer system available on the cloud for partner testing, placing Taiwan among the countries with self-made superconducting quantum computers. This accomplishment has had a significant impact on domestic quantum technology research, serving as a demonstration and inspiration for further advancements.

ITRI and TSMC are partnering to develop a SOT-MRAM array chip with lower power consumption and faster operation than STT-MRAM. The new design has potential applications in in-memory computation and is expected to advance the field of high-speed semiconductors. The General Director of ITRI’s Electronic and Optoelectronic System Research Laboratories, Chang Shih-chieh, highlighted the chip’s low power consumption and quick 10-nanosecond operating time, which enable improved computational efficiency and expand the potential applications beyond traditional memory-oriented scenarios. The research results were presented at the IEDM, showcasing the technology’s potential for high-performance computing, artificial intelligence, and automotive chips. Additionally, ITRI’s focus on non-volatile memory technologies demonstrates their commitment to pushing the boundaries of the domestic semiconductor markets and exploring new areas of application.

President Tsai Ing-wen highlights Taiwan’s growing global relevance and indispensability, as she reflects on the substantial changes during her seven-year presidency. Taiwan’s GDP has risen from NT＄17.5 trillion to an impressive NT＄23 trillion under her administration, thanks to initiatives aimed at investment and infrastructure development. Advanced semiconductor chip production has thrived, contributing to Taiwan’s economic stability and rapid advancement, surpassing the progress of the Four Asian Tigers. Tsai attributes this success to the unity and resilience of the Taiwanese people. She hopes that her administration’s efforts will have a lasting impact, sustaining Taiwan’s forward momentum for future leaders.

The smartphone market is set to rebound in 2024, according to Rick Tsai, chairman of MediaTek Inc., a global chip leader. Tsai attributes this growth to the increasing popularity of AI applications, which is driving the replacement of mobile phones and PCs and creating a higher demand for devices. Under Tsai’s leadership, MediaTek has released advanced products such as the Tianji 9300, a flagship 5G chip that supports generative AI applications. Qualcomm, another major chip company, is also capitalizing on the AI trend with its latest 5G handset chip, Snapdragon 8 Gen 3, which offers AI support for enhanced user experiences. Both companies anticipate a surge in AI smartphone upgrades due to improved computing power and a wider range of applications.

Taiwan Color Optics subsidiary SemiLux International Holdings is preparing for a NASDAQ listing in January 2024. The company, valued at $380 million, is set to make a significant impact in the realm of semiconductor technology, AI chip design, and autonomous driving solutions.

TSMC, the Taiwanese semiconductor manufacturing company, announced progress in the development of its 1.4nm-class technology node, A14, during the IEEE International Electron Devices Meeting. The company plans to begin volume production of its 2nm process chips, N2, in 2025, with the N2P process expected to reach mass production by the end of 2026. Market analysts predict that TSMC’s A14 process could debut between 2027 and 2028. While TSMC is also developing cutting-edge technologies like CFETs to boost chip performance and energy efficiency, the initial A14 process is expected to use GAAFETs technology. The use of High-NA EUV lithography technology in TSMC’s future processes, including the A14 process, remains unconfirmed. Other industry players like Intel are also adopting next-generation EUV technology with a numerical aperture of 0.55.

美國政府正與晶片大廠輝達公司（Nvidia Corp）商討允許向中國大陸銷售人工智慧晶片（AI chip）的問題，但強調輝達不能出售自家最先進的半導體給中國大陸企業。

Stores in Taiwan are introducing intelligent shopping carts equipped with either a Barcode Reader (BCR) or Radio-Frequency Identification (RFID) system for a modern shopping experience. The BCR option requires shoppers to scan items individually for a self-checkout experience, while carts with RFID systems display item information and total amount due on a chip embedded in the item tags, allowing for faster checkouts. However, the RFID system is ten times more expensive than BCR technology. Retailers rely on an Internet of Things (IoT) system to resolve discrepancies if customers forget to scan or intentionally conceal items. Some patrons find the self-checkout process cumbersome, especially when item scans are inaccurate. Shoppers are advised to double-check their post-checkout details to avoid overpaying due to machine errors.