TAIPEI (TVBS News) — The U.S. Department of Commerce(DOC) announced on Monday (April 8), that it will provide US$6.6 billion in subsidies and up to US$5 billion in low-interest loans to the Taiwan Semiconductor Manufacturing Company (TSMC) for the construction of an advanced semiconductor factory in Arizona.
TSMC has agreed to expand its planned investment, adding an additional US$25 billion, bringing the total to US$65 billion. By 2030, the company plans to build a third wafer factory in Arizona.
TSMC's second wafer factory in Arizona will produce the world's most advanced 2-nanometer chips, with production expected to begin in 2028.
According to the DOC, the US$65 billion investment is the largest foreign direct investment in a new project in U.S. history. It is expected to create 6,000 direct manufacturing jobs and 20,000 construction jobs.
Commerce Secretary Gina Raimondo said these chips are the backbone of artificial intelligence (AI) and a necessary component to support the economy.
