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MediaTek completes 2-nanometer chip design with TSMC

Reporter TVBS News Staff
Release time:2025/09/16 12:00
Last update time:2025/09/16 15:46
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MediaTek announces completion of 2-nanometer chip design (TVBS) MediaTek completes 2-nanometer chip design with TSMC
MediaTek announces completion of 2-nanometer chip design (TVBS)

TAIPEI (TVBS News) — MediaTek Inc. (聯發科), one of Taiwan's leading chip designer, announced Tuesday (Sept. 16) the completion of its flagship system-on-chip design using Taiwan Semiconductor Manufacturing Company Ltd's (TSMC, 台積電) cutting-edge 2-nanometer process technology. The breakthrough chip is scheduled for launch by the end of next year, marking a significant milestone in semiconductor advancement. President Joe Chen (陳冠州) emphasized the company's innovative capability in applying advanced process technology across diverse technological solutions.

Chen praised MediaTek's enduring partnership with TSMC, Taiwan's semiconductor manufacturing giant, which enables the company's flagship products to achieve exceptional performance and energy efficiency while delivering comprehensive solutions from edge computing to cloud services for global customers. TSMC's Senior Vice President of Business Development and Global Sales and deputy co-COO, Kevin Zhang (張曉強), described the 2-nanometer technology as a pivotal advancement into the nanosheet era, demonstrating the foundry's unwavering commitment to fulfilling customer demands.

 

MediaTek emphasized its commitment to deepening collaboration with TSMC across multiple technology sectors, including flagship mobile platforms, advanced computing systems, automotive applications, and data center infrastructure. The partnership aims to develop next-generation high-performance, low-power chipsets that will drive innovation across these critical technology markets while maintaining Taiwan's leadership position in the global semiconductor industry. ◼

Taiwan Business

#MediaTek# TSMC# 2-nanometer process# system-on-chip# semiconductor technology# high performance# energy efficiency# flagship mobile platforms# advanced semiconductor process technology# high-performance low-power chipsets

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