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    packaging costs 結果共2筆

  • HeySong Sarsaparilla price hike: First in over a decade

    HeySong Corporation, a Taiwanese company, has announced price adjustments for some of its products after 10-20 years of unchanged prices. The adjustments, set to take effect in March, will see prices increase by 10-20%. The most notable increase will be for the popular 330-milliliter HeySong Sarsaparilla, which will surge by up to 25%. The company attributes the price adjustments to rising costs of raw materials, packaging, transportation, and personnel. The recommended retail price adjustments will mainly affect packages less than one liter, with some increasing by NT$4 and others by NT$5-6. Other beverage brands, such as Taisun Enterprise, have also indicated rising drink prices due to increased international raw material costs. The King Car Group had already adjusted the price of its Pocari Sweat drink in November 2020, marking the first price adjustment in 17 years. Public opinion on the price changes seems to be accepting, with many stating that they understand most products are experiencing price increases as long as the surge isn’t too high.
    2024/02/17 11:21
  • TSMC sees orders hike as October revenue hits record levels

    Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.
    2023/11/16 21:24
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