TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) denied Thursday (Sept. 18) halting construction of its second advanced packaging facility in Chiayi, southwestern Taiwan. The world's largest contract chipmaker reassured stakeholders its commitment to local projects remains unchanged amid significant U.S. expansion plans.
TSMC announced plans in March to increase U.S. investment by US$100 billion (around NT$3 trillion), raising Arizona investment to US$165 billion (around NT$4.97 trillion). The expansion includes six wafer fabs, two advanced packaging facilities, and one R&D center. Chairman and CEO C.C. Wei (魏哲家) stated the expansion meets U.S. client demand without affecting Taiwan investments.
Speculation emerged about TSMC accelerating Arizona construction timelines for its second and third plants, with reports suggesting equipment intended for Chiayi's second plant may be redirected to the U.S. Chiayi County Magistrate Weng Chang-liang (翁章梁) confirmed in June that Chiayi's first plant would begin equipment installation in the third quarter, with the second plant completing in 2026. ◼ (At time of reporting, US$1 equals approximately NT$30.095)
