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  • 熱門搜尋:
    使用者付費國道運將摸胸母親南珉貞交友軟體林秉文賴清德梁軒安颱風生成
  • 搜尋:

    Chip packaging CoWoS facilities in Chiayi Science Park 結果共1筆

  • TSMC to build 2 advanced chip facilities in Chiayi

    Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.
    2024/03/18 15:17
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