TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (台積電, TSMC) and the European Semiconductor Manufacturing Company (ESMC) announced on Monday (June 10) plans to deploy hundreds of TSMC engineers and hire nearly 2,000 employees over the next three to five years in Dresden, Germany.
This move, revealed during the Taiwan-EU Semiconductor Forum in Berlin, marks a pivotal step in strengthening the semiconductor manufacturing capabilities in Europe.
The forum, which gathered TSMC's supply chain and partners, served as a platform for Christian Koitzsch, the president of ESMC, to highlight the critical role of ESMC in the transformation and upgrading of Europe's semiconductor ecosystem. Koitzsch, who transitioned to ESMC from Bosch earlier this year, emphasized the collaborative effort between TSMC and leading European semiconductor companies like Bosch, Infineon, and NXP in establishing ESMC. The joint venture aims to commence mass production by 2027.
Koitzsch pointed out that the construction of a 45,000-square-meter cleanroom facility by ESMC would reduce production costs, enhance wafer manufacturing competitiveness, and create job opportunities. To expedite the construction process, Taiwanese employees will assist in Dresden, while German staff receive training in Taiwan to improve future operational efficiency and contribute to the local semiconductor industry ecosystem.