semiconductor technology 結果共40筆

Explore how Taiwan’s impending Memorandum of Understanding with India aims to address labor shortages by fostering an exchange of skilled professionals, enhancing the high-tech workforce, and promoting cultural integration.

TSMC, the Taiwanese semiconductor manufacturing company, announced progress in the development of its 1.4nm-class technology node, A14, during the IEEE International Electron Devices Meeting. The company plans to begin volume production of its 2nm process chips, N2, in 2025, with the N2P process expected to reach mass production by the end of 2026. Market analysts predict that TSMC’s A14 process could debut between 2027 and 2028. While TSMC is also developing cutting-edge technologies like CFETs to boost chip performance and energy efficiency, the initial A14 process is expected to use GAAFETs technology. The use of High-NA EUV lithography technology in TSMC’s future processes, including the A14 process, remains unconfirmed. Other industry players like Intel are also adopting next-generation EUV technology with a numerical aperture of 0.55.

Chinese companies are increasingly establishing supply chains in Vietnam as U.S. companies like Apple move production there, according to Japanese media reports. Export restrictions on advanced semiconductors and semiconductor production equipment to China by the Biden Administration have led to difficulties for Chinese manufacturers, prompting a shift in investment towards alternative manufacturing bases like Vietnam. Approved foreign direct investment in Vietnam increased by 15% from January to November 2023, with Chinese investment, including from Hong Kong and Macao, doubling from the previous year. Chinese investment in Vietnam is even higher when routed through subsidiaries based in Singapore and Thailand. Notable investments include Shandong Haohua Tire Co. Ltd.’s US$500 million investment and Trina Solar Co., Ltd.’s US$420 million decision. BYD Company also announced an expansion investment of US$144 million, bringing its total investment in Vietnam to over US$400 million. Japanese experts believe that Chinese enterprises must engage in joint advancements in cutting-edge technology with local entities to be seen as partners by the Vietnamese.

DPP vice-presidential candidate Hsiao Bi-khim visited the TSMC Museum of Innovation and stated that Taiwan Semiconductor Manufacturing Co (TSMC) would remain based in Taiwan while expanding into trusted partner countries. Concerns about brain drain and technology outflow have arisen as TSMC expands globally. Hsiao emphasized that the first ＂T＂ in TSMC stands for Taiwan and highlighted the importance of strategic placement in partner countries. Drawing on her experience in the United States, Hsiao mentioned her efforts to prevent double taxation agreements, which benefit Taiwan’s talent and industries. Her visit and comments coincide with TSMC’s international strategies being closely scrutinized as it seeks to maintain its competitive edge in a complex geopolitical landscape.

Western Digital Corporation (WD) has announced that it will increase prices in response to the recent price hikes in the memory chip industry. Following Samsung’s 20% price increase, WD has informed its downstream channels and contract manufacturers that hard drive products will be subject to weekly price reviews, with adjustments expected to begin in the first half of next year. The company has projected that the cumulative increase in NAND Flash prices could reach up to 55%. These price increases align with the World Semiconductor Trade Statistics (WSTS) organization’s projection of a 44.8% revenue growth in the memory market for the coming year. Market research firm Gartner has estimated an even more significant surge, predicting a 66.3% increase in memory market revenue. While this suggests a strong demand for memory products, it also indicates rising costs for manufacturers and potentially higher prices for consumers in the technology sector.

Taiwan aims to leverage its information and communication technology (ICT) and semiconductor industries to gain a competitive advantage in international markets. The Ministry of Economic Affairs Minister, Wang Mei-hua, witnessed the signing of a memorandum of understanding between the Taiwan Association of Information and Communication Standards (TAICS) and the 5G Alliance for Connected Industries and Automation (5G-ACIA), signaling a new era of cooperation. With the global smart manufacturing market projected to reach US$140 billion by 2030, Wang believes Taiwan is well-positioned to integrate 5G into smart factories due to its existing experience and infrastructure. Taiwan aims to align its 5G application standards with global benchmarks and contribute its knowledge to international organizations. The Ministry of Economic Affairs is supporting the Industrial Technology Research Institute (ITRI) in developing new technologies and collaborating with Taiwanese companies to establish a voice within the global 5G community through 5G-ACIA. This strategic partnership is expected to position Taiwan as a leader in next-generation industrial technology and solidify its role in the information and communication technology sector on the global stage.

The Minister of Economic Affairs, Wang Mei-hua, stated that the release of the list of key national technologies will not impact businesses as they have been consulted beforehand. The focus is on enhancing the protection of critical technologies. The National Science and Technology Council revealed a list of 22 core national key technologies across defense, agriculture, semiconductors, space, and cyber-security, including two semiconductor technologies. Personnel involved with key technologies receiving over 50% subsidies from the government must seek permission before traveling to China, as per the National Security Act and the Act Governing Relations between the People of the Taiwan Area and the Mainland Area. The two semiconductor technologies listed are IC fabrication technology for processes smaller than 14 nanometers and heterogeneous integration packaging technology. Wang emphasized the importance of protecting key technologies to prevent confidential business information leakage and enhance national security standards. The next steps involve reviewing and providing lists of personnel meeting certain subsidy thresholds and involved with sensitive technologies to relevant entities for management purposes.

Nvidia’s President, Jensen Huang, stated at the New York Times’ DealBook Summit that achieving U.S. independence in the chip supply chain and reducing reliance on overseas manufacturing could take 10 to 20 years. President Joe Biden’s administration has imposed a ban on chip exports to China, citing national security concerns and the need to maintain the U.S.’s lead in the semiconductor industry. Nvidia, among other companies, is impacted by these export control measures, leading to concerns about negative impacts on the company’s revenue. However, Huang revealed that Nvidia is developing chips compliant with U.S. regulations for the Chinese market and plans to re-enter once they are ready. He also warned that the export ban could accelerate China’s domestic chip development, with numerous Chinese companies already working on competing technologies. Huang emphasized that Nvidia is already a decade ahead in artificial intelligence technology and that AI and deep learning innovation involve more than just designing new chips.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.

The total semiconductor industry output is projected to reach NT＄4.3 trillion in 2023, with a year-on-year decrease of 11.2%, according to a revised forecast by Taiwan’s Industrial Technology Investment Corporation (ITRI). The wafer foundry industry is expected to have an output value of NT＄2.46 trillion, surpassing the earlier forecast of NT＄2.38 trillion, and showing an 8.2% yearly decrease. The semiconductor manufacturing industry, including wafer foundry and DRAM, is set to have an output value of NT＄2.64 trillion, with a year-on-year decrease of 9.6%. TSMC’s operational growth is likely to contribute to an anticipated 8.1% growth in Taiwan’s semiconductor manufacturing output in the fourth quarter.

NVIDIA founder and CEO Jensen Huang praised Taiwan Semiconductor Manufacturing Co. (TSMC) founder Morris Chang, acknowledging that his company would not exist without the foundation laid by the world’s largest chipmaker. Huang lauded TSMC’s manufacturing of advanced chips, their constant innovation, and their ability to push the boundaries of physics. He referred to Chang as the ＂Godfather of Technology＂ in Taiwan. Chang was honored with the KT Li Award, and President Tsai Ing-wen personally congratulated him. Huang, who traveled from the U.S. with his wife to attend the event, reminisced about his first meeting with Chang and acknowledged TSMC’s significant impact on NVIDIA by accommodating its evolving needs.

Explore the deepening industrial relationship between Taiwan and Germany as German Institute Taipei Director-General Jörg Polster praises the long-standing ties. Following TSMC’s announcement of its first European factory in Germany, Polster emphasizes mutual growth opportunities and highlights plans for student exchanges in 2024.

Taiwan’s Vice President Lai Ching-te calls for transforming Taiwan into Asia’s Silicon Valley during a speech in San Francisco. He highlights Taiwan’s tech achievements and global ties.

Recently, numerous science and technology institutions have focused on training talents for the semiconductor sector.

The leaders of the world’s top superpowers, Chinese President Xi Jinping and U.S. President Joe Biden, met in person in Bali at the G20 summit for the first time since Biden took office. Against this backdrop, TVBS Commentator Wenchi Yu spoke with Brendan Carr, commissioner of the Federal Communication Commissions of the U.S., on information censorship, semiconductor chips, and all things related to information and communications technology with the U.S., China, and Taiwan.