TAIPEI (TVBS News) — The head of the National Science and Technology Council (NSTC, 國科會) announced TSMC's (台積電) plans to expand its operations in Europe during a Bloomberg interview aired Monday (Oct. 15). NSTC Minister Wu Cheng-wen (吳誠文), highlighted TSMC's intention to build several wafer fabs targeting different market segments, sparking widespread interest.
TSMC has already initiated construction on its first wafer fab in Dresden, aligning with its strategic vision. Despite Wu's comments, TSMC reportedly plans to emphasize its current focus on existing global projects, meaning no new overseas investments planned.
TSMC has co-founded ESMC in collaboration with Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V.. The joint venture plans to break ground by the end of 2024. ESMC will utilize TSMC's advanced 28, 22-nanometer planar CMOS and 16, 12-nanometer FinFET process technologies, aiming for a monthly capacity of approximately 40,000 12-inch wafers.
