TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) announced on Friday (Oct. 4) a collaboration with Amkor Technology, Inc. to expand artificial intelligence (AI) capacity in Arizona.
This partnership aims to leverage Amkor's forthcoming facility in Peoria, Ariz., to enhance TSMC's advanced packaging and testing services for its clients, the semiconductor giant stated.
TSMC has maintained a long-standing partnership with Amkor to offer cutting-edge semiconductor packaging and testing technologies. This collaboration supports critical markets such as high-performance computing and communication.
According to the agreement, TSMC will utilize the turnkey services provided by Amkor's new facility, particularly benefiting clients of TSMC's advanced wafer manufacturing plant in Phoenix.
Dr. Kevin Zhang (張曉強), TSMC's senior vice president of business development and global sales, expressed enthusiasm about the partnership. "TSMC is pleased to work alongside a trusted long-term strategic partner like Amkor to support these customers with a more diversified production base," Zhang said.
Amkor CEO Giel Rutten echoed this sentiment, saying, "Amkor is honored to collaborate with TSMC, providing a seamless integration of semiconductor manufacturing and packaging technology through our efficient turnkey advanced packaging and testing business model."
