Taiwan nears completion of chip center with Czechia

TAIPEI (TVBS News) — Taiwan's Ministry of Foreign Affairs (MOFA) announced on Wednesday (April 24) that it was getting close to the end of a five-year agreement with Czechia to build an advanced center for chip design and enhance semiconductor capabilities. The finance implementation phase of the plan is currently underway, having been negotiated since the end of 2022.

However, Ken Chang of the Taiwan People's Party (TPP) claimed that Taiwan hastily allocated funds to Czechia before Vice President-elect Hsiao Bi-khim visited Europe. He also alleged that the original US$13.5 million was insufficient to operate the project and that Taiwan's request for Czechia to make up the shortfall was rejected.

MOFA clarified that the initiative aims to help Czechia, which already has an advanced industrial base, establish a semiconductor industry capacity based on Taiwanese technology. It will also assist Taiwanese semiconductor companies in linking with local chains, further securing European business opportunities.

The ministry emphasized that the project is budgeted and led by Taiwan, so Taiwan is not asking Czechia to compensate for a funding shortfall.

MOFA expressed regret over repeated false statements about the Taiwan-Czechia chip cooperation and urged opposition party members to verify facts before speaking to avoid causing trouble for the governments of both countries.