Unimicron ABF substrate 結果共3筆

While AI hardware headlines focus on GPU chips and server assemblers, deeper in the stack a quieter crisis is unfolding. Circuit board and materials manufacturers are facing their tightest supply conditions in years, and the constraints are rippling through the entire AI hardware ecosystem. For Q2 2026, the picture is one of surging demand, record investment, and persistent shortages that will take years to resolve.

Every AI accelerator that powers today’s largest models relies on an advanced substrate to connect the chip to the outside world. These ABF substrates, the high-performance interconnect layers that bridge GPU dies and circuit boards inside advanced packages, can only be manufactured at the required specifications by Japan’s Ibiden and Taiwan’s Unimicron Technology. 

The AI infrastructure story has mostly been told through the lens of advanced chips and the foundries that produce them. But there is another layer of the supply chain, often overlooked, that determines whether any of these systems actually work. Signals must be transmitted. Power must be delivered across increasingly complex architectures. And the companies solving these high-density interconnect challenges are increasingly headquartered in Taiwan.