High-bandwidth memory 結果共8筆

Nvidia CEO Jensen Huang unveiled the Vera Rubin platform at GTC Taipei, highlighting its AI agent capabilities and four core advantages of the Vera CPU.

Global memory chip sales will more than double in 2026 as AI demand creates a ’super cycle,’ benefiting Taiwan’s Nanya Technology and Winbond.

AI demand reshapes Taiwan’s memory market, driving up costs and creating a digital divide. Local tech prices soar as manufacturers prioritize AI over consumer needs.

For most of its 38-year history, King Yuan Electronics Co. (KYEC, 2449.TW) operated in the background of the semiconductor industry by testing chips after fabrication, a necessary but unglamorous step. The AI era has changed that calculus entirely. As the world’s largest pure-play testing company, KYEC now validates the most advanced accelerators ever built, and surging demand has transformed its testing floors from routine checkpoints into one of the AI supply chain’s defining bottlenecks.

Powertech Technology (6239.TW) has spent nearly three decades as the world’s largest memory packaging and testing company. Now, as advanced packaging becomes the tightest bottleneck in the AI supply chain, Powertech is positioning itself as the credible alternative to TSMC’s CoWoS platform. With a proprietary glass-substrate technology that rivals TSMC at significantly lower cost, Powertech has gone from quiet memory specialist to one of the most strategically important companies in the AI chip ecosystem.

Global semiconductor manufacturing equipment sales reached a record US$135.1 billion in 2025, up 15% from US$117.1 billion in 2024, according to the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report published by SEMI on April 13, 2026. The growth was driven by sustained expansion in advanced logic and memory capacity, underpinned by accelerating AI-related demand.

For decades, making chips faster meant shrinking transistors. That approach is hitting physical and economic limits. The semiconductor industry has found a powerful alternative: instead of building one giant chip, engineers now place several smaller chips side by side or stack them vertically inside a single package, connecting them with ultra-fast internal wiring. This is advanced packaging, and it has become the most critical bottleneck in the global AI supply chain.

Before the high-bandwidth memory in today’s AI accelerators can function, each chip must be precisely packaged, bonded, and tested to meet exacting specifications. Powertech Technology (PTI), Taiwan’s second-largest outsourced semiconductor assembly and test (OSAT) provider, handles this critical work for many of the world’s leading memory and AI chip makers. As AI infrastructure spending accelerates beyond US$650 billion in annual hyperscaler capital expenditure, Powertech has emerged as both a linchpin of the memory supply chain and a serious contender in advanced AI chip packaging.