CoWoP 結果共4筆

臻鼎科技（Zhen Ding Technology）已連續八年蟬聯全球營收最大的印刷電路板（PCB）製造商。這家2006年從鴻海（Foxconn）分拆獨立的公司，如今正從行動電子領域轉向AI基礎建設的核心，規劃於2026至2027年間投入逾新台幣1,000億元（約31.6億美元）資本支出，並有十座新廠同步興建中。

Zhen Ding Technology has been the world’s largest printed circuit board manufacturer by revenue for eight consecutive years. Originally spun out of Foxconn in 2006, the company is now pivoting from mobile electronics into the heart of AI infrastructure, with over NT$100 billion (US$3.16 billion) in capex planned across 2026–2027 and ten new factories under construction.

ASE Technology Holding (2311.TW) is the world’s largest outsourced semiconductor assembly and test company, commanding more than 30% of the global market. For four decades the Kaohsiung-based firm has performed the essential final steps of chipmaking: turning raw silicon wafers into functional, tested chips ready for deployment. As advanced packaging becomes the tightest bottleneck in the AI supply chain, ASE has moved from behind-the-scenes enabler to one of the most strategically important companies in global technology.

For decades, making chips faster meant shrinking transistors. That approach is hitting physical and economic limits. The semiconductor industry has found a powerful alternative: instead of building one giant chip, engineers now place several smaller chips side by side or stack them vertically inside a single package, connecting them with ultra-fast internal wiring. This is advanced packaging, and it has become the most critical bottleneck in the global AI supply chain.