Capital expenditure 結果共15筆

Taiwan’s manufacturing engine is running faster than ever, and AI is doing most of the work. According to figures released by the Ministry of Economic Affairs (MOEA) on April 23, the headline industrial production index reached 136.90 in March 2026, up 26.35% from February and 28.68% from a year earlier. The first three months of 2026 mark the strongest opening quarter for Taiwan’s manufacturing sector in years, and the chart points sharply upward even after seasonality is stripped out.

TSMC Chairman and CEO C.C. Wei struck a resoundingly bullish tone on AI demand during the company’s Q1 2026 earnings call on April 16, making clear that the AI wave is continuing to accelerate and TSMC is running as hard as it can to keep up.

Zhen Ding Technology has been the world’s largest printed circuit board manufacturer by revenue for eight consecutive years. Originally spun out of Foxconn in 2006, the company is now pivoting from mobile electronics into the heart of AI infrastructure, with over NT$100 billion (US$3.16 billion) in capex planned across 2026–2027 and ten new factories under construction.

While AI hardware headlines focus on GPU chips and server assemblers, deeper in the stack a quieter crisis is unfolding. Circuit board and materials manufacturers are facing their tightest supply conditions in years, and the constraints are rippling through the entire AI hardware ecosystem. For Q2 2026, the picture is one of surging demand, record investment, and persistent shortages that will take years to resolve.

Every AI chip needs a way to dissipate the intense heat it generates. That is where Asia Vital Components (AVC) comes in. The Kaohsiung-based thermal specialist has become one of the most important companies in the global AI supply chain, and its Q1 2026 results show just how fast this business is growing.

ASE Technology Holding (2311.TW) is the world’s largest outsourced semiconductor assembly and test company, commanding more than 30% of the global market. For four decades the Kaohsiung-based firm has performed the essential final steps of chipmaking: turning raw silicon wafers into functional, tested chips ready for deployment. As advanced packaging becomes the tightest bottleneck in the AI supply chain, ASE has moved from behind-the-scenes enabler to one of the most strategically important companies in global technology.

Before the high-bandwidth memory in today’s AI accelerators can function, each chip must be precisely packaged, bonded, and tested to meet exacting specifications. Powertech Technology (PTI), Taiwan’s second-largest outsourced semiconductor assembly and test (OSAT) provider, handles this critical work for many of the world’s leading memory and AI chip makers. As AI infrastructure spending accelerates beyond US$650 billion in annual hyperscaler capital expenditure, Powertech has emerged as both a linchpin of the memory supply chain and a serious contender in advanced AI chip packaging.

Hon Hai Chairman Young Liu discusses minimal impact of U.S. tariffs, strategic AI server production, and plans for new U.S. sites. Revenue may exceed NT$7 trillion.

Taiwan’s stock market sees fluctuations as TSMC’s stock initially rises then falls. TSMC forecasts growth amid AI demand, boosting the semiconductor index.

Citi analysts predict NVIDIA will surpass Apple as TSMC’s largest customer by 2025, driving AI-related revenue growth. TSMC’s 3-nanometer process adoption will boost profitability.

Quanta Chairman Barry Lam expresses optimism about economic growth post-Trump inauguration, highlighting AI advancements. Quanta sees record profits and plans expansion.

Goldman Sachs predicts that Taiwan Semiconductor Manufacturing Company (TSMC) will double its CoWoS production capacity by 2025, leading to a raised target price of NT$975. The forecast includes plans for advanced CoWoS packaging plants in Chiayi and potential expansion to Japan. Customer demand for advanced packaging, especially CoWoS, is expected to rise with the adoption of 2-nanometer process technology. Goldman Sachs also revised TSMC’s capital expenditure forecast and profit outlook for major AI companies, reflecting a positive growth trend in the industry.

AU Optronics Corp’s Chief Financial Officer, Benjamin Tseng, announced that the company’s capital expenditures for 2023 are likely to be revised downward to around NT$30 billion. This represents a decrease of NT$5 billion, or 14.3%, from the initial target of NT$35 billion. Tseng also mentioned that AUO’s capacity utilization rate reached approximately 80% in the third quarter of this year but expects a slight decrease in the final quarter.

Taiwan Semiconductor Manufacturing Co. (TSMC) announced its financial results for the third quarter of 2023, revealing a capital expenditure projection of NT＄226.6 billion for the year. The company plans to allocate 70% of this capital outlay to advanced processes, 20% to specialized processes, and 10% to packaging and other related sectors. TSMC’s consolidated revenue for the third quarter decreased by 10.8% compared to the same period last year, reaching approximately NT＄546.73 billion. The earnings per share (EPS) stood at NT＄8.14.

TSMC has experienced an 11% drop in its stock price over the past five months, making it the most significant decline among Asian stocks. Goldman Sachs Group has lowered its capital expenditure expectations for TSMC for next year by over 20%, citing concerns about the postponement of its overseas capacity expansion plan.