Advanced packaging equipment 結果共4筆

Global semiconductor manufacturing equipment sales reached a record US$135.1 billion in 2025, up 15% from US$117.1 billion in 2024, according to the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report published by SEMI on April 13, 2026. The growth was driven by sustained expansion in advanced logic and memory capacity, underpinned by accelerating AI-related demand.

National Taiwan University of Science and Technology and GPTC signed a NT$50 million deal to boost semiconductor research and talent development. The partnership focuses on equipment integration, material innovation, and offers scholarships and job opportunities for students.

As artificial intelligence transforms the global technology landscape, Taiwan’s fully integrated supply chain has become the indispensable foundation for next-generation AI chips. With seamless connections spanning IC design, wafer fabrication, advanced packaging, testing, equipment, and materials, Taiwan’s ecosystem delivers the agility, innovation, and scale that the fast-moving AI market demands. Taiwan now produces over 90% of advanced AI chips and AI servers, a concentration unprecedented in technology history.

TSMC denies halting Chiayi plant plans amid U.S. focus. Deputy Minister Ho confirms support for TSMC’s local projects. Taiwan addresses power supply concerns.