AI chip packaging 結果共19筆

TSMC’s April revenue of NT$410.7 billion (US$12.6 billion) was up 17.5 percent year on year and down 1.1 percent from March, the company’s highest April on record and second-highest monthly result ever. Cumulative revenue for the first four months reached NT$1.545 trillion (US$47.4 billion), up 29.9 percent from the same period in 2025.

At its 2026 North America Technology Symposium, TSMC unveiled a roadmap that highlights where the world’s largest contract chipmaker is placing its boldest bets and where it is choosing restraint.

Zhen Ding Technology has been the world’s largest printed circuit board manufacturer by revenue for eight consecutive years. Originally spun out of Foxconn in 2006, the company is now pivoting from mobile electronics into the heart of AI infrastructure, with over NT$100 billion (US$3.16 billion) in capex planned across 2026–2027 and ten new factories under construction.

Powertech Technology (6239.TW) has spent nearly three decades as the world’s largest memory packaging and testing company. Now, as advanced packaging becomes the tightest bottleneck in the AI supply chain, Powertech is positioning itself as the credible alternative to TSMC’s CoWoS platform. With a proprietary glass-substrate technology that rivals TSMC at significantly lower cost, Powertech has gone from quiet memory specialist to one of the most strategically important companies in the AI chip ecosystem.

ASE Technology Holding (2311.TW) is the world’s largest outsourced semiconductor assembly and test company, commanding more than 30% of the global market. For four decades the Kaohsiung-based firm has performed the essential final steps of chipmaking: turning raw silicon wafers into functional, tested chips ready for deployment. As advanced packaging becomes the tightest bottleneck in the AI supply chain, ASE has moved from behind-the-scenes enabler to one of the most strategically important companies in global technology.

For decades, making chips faster meant shrinking transistors. That approach is hitting physical and economic limits. The semiconductor industry has found a powerful alternative: instead of building one giant chip, engineers now place several smaller chips side by side or stack them vertically inside a single package, connecting them with ultra-fast internal wiring. This is advanced packaging, and it has become the most critical bottleneck in the global AI supply chain.

Computex has long served as a barometer for the global technology industry. This year’s edition, running June 2–5 in Taipei under the banner “AI Together,” carries added weight. The first quarter of 2026 delivered a cascade of transformative developments: a landmark US-Taiwan trade agreement, hundreds of billions of dollars in new capital commitments, an intensifying supply crunch at the most advanced chip nodes, and the rise of Physical AI as the industry’s next organizing principle. Together, these shifts are realigning Taiwan’s technology economy. Computex is where these threads will converge in public.

Every AI accelerator that powers today’s largest models relies on an advanced substrate to connect the chip to the outside world. These ABF substrates, the high-performance interconnect layers that bridge GPU dies and circuit boards inside advanced packages, can only be manufactured at the required specifications by Japan’s Ibiden and Taiwan’s Unimicron Technology. 

Before the high-bandwidth memory in today’s AI accelerators can function, each chip must be precisely packaged, bonded, and tested to meet exacting specifications. Powertech Technology (PTI), Taiwan’s second-largest outsourced semiconductor assembly and test (OSAT) provider, handles this critical work for many of the world’s leading memory and AI chip makers. As AI infrastructure spending accelerates beyond US$650 billion in annual hyperscaler capital expenditure, Powertech has emerged as both a linchpin of the memory supply chain and a serious contender in advanced AI chip packaging.

The artificial intelligence revolution runs on silicon, but not just any silicon. The processors driving today’s most advanced AI systems demand a level of integration and performance that pushes semiconductor engineering to its limits. At the center of this challenge sits CoWoS (Chip-on-Wafer-on-Substrate), an advanced packaging technology developed by TSMC that has quietly become the essential foundation of AI infrastructure worldwide.

For decades, the companies that package and test the world’s semiconductors have been the unsung heroes of the chip industry. While designers like Nvidia grabbed headlines and foundries like TSMC earned Wall Street’s admiration, outsourced semiconductor assembly and test (OSAT) firms quietly handled the essential final steps of turning raw silicon into functional chips. That era of invisibility is ending fast. Fueled by the artificial intelligence revolution, Taiwan’s OSAT industry is stepping into the spotlight. The island controls 48% of the global OSAT market, employs over 130,000 skilled workers, and is home to five of the world’s top ten OSAT companies. What was once considered a commodity business has become an indispensable link in the AI supply chain.

As artificial intelligence transforms the global technology landscape, Taiwan’s fully integrated supply chain has become the indispensable foundation for next-generation AI chips. With seamless connections spanning IC design, wafer fabrication, advanced packaging, testing, equipment, and materials, Taiwan’s ecosystem delivers the agility, innovation, and scale that the fast-moving AI market demands. Taiwan now produces over 90% of advanced AI chips and AI servers, a concentration unprecedented in technology history.

TSMC showcased its Chiayi Advanced Packaging Fab 7, highlighting investment in Taiwan’s packaging capabilities. The site aims to meet AI-driven demand.

The Taiwan Semiconductor Research Institute launched a chip-level advanced packaging R&D platform, featuring CoCoB technology, to boost Taiwan’s semiconductor innovation.

TSMC celebrated a milestone with its AP8 plant ceremony, highlighting its expansion in advanced packaging. The move strengthens TSMC’s industry leadership amid rising AI demand.

Discover insights from Tien Wu, CEO of ASE, on Taiwan’s pivotal role in the AI and semiconductor industries, emphasizing collaboration and adaptability at SEMICON Taiwan 2024.

SEMICON Taiwan 2024 to focus on AI era Over 1,000 exhibitors across 3,600 booths 16 themes, including new AI Zone 13 country pavilions for global cooperation

Discover how Taiwan is addressing the global AI supply crisis and advancing AI technology, as highlighted at the COMPUTEX event in Taipei, featuring industry leaders and innovative solutions.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.