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  • 歷史搜尋:
  • 熱門搜尋:
    登山比基尼前科宮廷劇廖大乙捐款車禍1死5傷三重賓士撞警新北死亡車禍
  • 搜尋:

    chip packaging 結果共4筆

  • SEMICON Taiwan to spotlight AI role in semiconductor future

    SEMICON Taiwan 2024 to focus on AI era Over 1,000 exhibitors across 3,600 booths 16 themes, including new AI Zone 13 country pavilions for global cooperation
    2024/06/24 11:10
  • Taiwan’s role crucial in global AI supply chain, expert says

    Discover how Taiwan is addressing the global AI supply crisis and advancing AI technology, as highlighted at the COMPUTEX event in Taipei, featuring industry leaders and innovative solutions.
    2024/06/03 17:13
  • TSMC to build 2 advanced chip facilities in Chiayi

    Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.
    2024/03/18 15:17
  • TSMC sees orders hike as October revenue hits record levels

    Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.
    2023/11/16 21:24
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