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    柏油路長輩領錢新竹縣小琉球房產抵押 玉米黃素飛越比佛利桃園性侵廠房法拍 營養吸收率
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  • TSMC to build 2 advanced chip facilities in Chiayi

    Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.
    2024/03/18 15:17
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