TAIPEI (TVBS News) — Taiwan unveiled a breakthrough chip packaging platform that could accelerate AI technology development Tuesday (Jan. 13). The Taiwan Semiconductor Research Institute (國研院半導體中心) launched the substrate-free CoCoB (Chip-on-Chip-on-Board) technology, giving researchers and startups access to advanced packaging resources previously unavailable. The platform has already attracted 16 research teams for chip design and verification projects.
Cheng-Wen Wu (吳誠文), Minister of the National Science and Technology Council, said the technology provides a crucial foundation for AI applications, including silicon photonics, quantum computing, and intelligent robotics. The CoCoB structure eliminates traditional substrates by directly connecting interposer chips to circuit boards**, boosting** integration density and system performance. This approach cuts substrate costs and simplifies manufacturing processes for academic institutions and startups developing heterogeneous integration solutions.
Deputy Director Chuang Ying-tsung (莊英宗) of the Taiwan Semiconductor Research Institute explained the technology shortens signal transmission paths while cutting costs for researchers. The platform enables academic institutions and startups to conduct heterogeneous integration experiments previously limited to major corporations with extensive resources. Minister Wu added the initiative will accelerate AI technology commercialization and strengthen Taiwan's position in global semiconductor innovation.
The open platform attracted 16 domestic and international research teams working on diverse chip module design and verification projects since its announcement. Institute officials said the technology positions Taiwan to lead the next phase of system integration and application innovation in semiconductors. The breakthrough addresses longstanding barriers that prevented smaller organizations from accessing advanced packaging capabilities. ◼
